1.2A PWM Step-Down Converter in
2mm x 2mm WLP/UCSP for PA Power
2 _______________________________________________________________________________________
ABSOLUTE MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
(V
IN1A
= V
IN1B
= V
IN2
= V
PA_EN
= V
EN2
= 3.6V, V
HP
= 0V, T
A
= -40癈 to +85癈. Typical values are at T
A
= +25癈, unless otherwise
noted.) (Note 1)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
IN1A, IN1B, IN2, EN2, REFBP to AGND................-0.3V to +6.0V
PAA, PAB, PA_EN, HP to AGND....-0.3V to (V
IN1A
/V
IN1B
+ 0.3V)
LDO2 to AGND..........................................-0.3V to (V
IN2
+ 0.3V)
IN2 to IN1B/IN1A...................................................-0.3V to +0.3V
PGND to AGND.....................................................-0.3V to +0.3V
LX Current......................................................................0.7A
RMS
IN1A/IN1B and PAA/PAB Current.....................................2A
RMS
PAA and PAB Short Circuit to GND or IN...................Continuous
Continuous Power Dissipation (T
A
= +70癈)
16-Bump WLP (derate 12.5mW/癈 above +70癈).............1W
16-Bump UCSP (derate 12.5mW/癈 above +70癈)..........1W
Junction Temperature......................................................+150癈
Storage Temperature Range.............................-65癈 to +150癈
Bump Temperature (soldering, reflow)............................+260癈
PARAMETER
CONDITIONS
MIN TYP MAX UNITS
INPUT SUPPLY
Input Voltage
V
IN1A
, V
IN1B
, V
IN2
2.7
5.5 V
Input Undervoltage Threshold V
IN1A
, V
IN1B
, V
IN2
rising, 180mV typical hysteresis
2.52 2.63
2.70 V
HP, PA_EN, EN2 Pulldown
Resistor
400 800
1600 k&
T
A
= +25癈
0.1
4
Shutdown Supply Current
V
PA_EN
= V
EN2
= 0V
T
A
= +85癈
0.1
礎
V
PA_EN
= 0V, I
LDO2
= 0A
100
150
V
EN2
= 0V, I
PA
= 0A, switching
3500
No-Load Supply Current
V
EN2
= 0V, I
PA
= 0A, no switching
180
礎
THERMAL PROTECTION
Thermal Shutdown
T
A
rising, 20癈 typical hysteresis
+160
癈
LOGIC CONTROL
PA_EN, EN2, HP Logic-Input
High Voltage
1.3
V
PA_EN, EN2, HP Logic-Input Low
Voltage
0.4 V
T
A
= +25癈
0.01 1
Logic-Input Current
(PA_EN, EN2, HP)
V
IL
= 0V
T
A
= +85癈
0.1
礎
PA OUTPUT VOLTAGE
HP = 0
3.365 3.434 3.503
Output Voltage
I
LX
= 0A, V
IN1A
= V
IN1B
= V
IN2
= 3.9V
HP = 1
3.010 3.065 3.190
V
Output Voltage Load Regulation
I
LX
x
R
L
/2
V
Note:This device is constructed using a unique set of packaging techniques that impose a limit on the thermal profile the device
can be exposed to during board level solder attach and rework. This limit permits only the use of the solder profiles recom-
mended in the industry-standard specification, JEDEC 020A, paragraph 7.6, Table 3 for IR/VPR and Convection reflow.
Preheating is required. Hand or wave soldering is not allowed.
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